Leading Semiconductor Enterprises from Japan and South Korea Partner with FPT

At the recent announcement ceremony for the establishment of FPT’s Advanced Semiconductor Testing and Packaging Factory, FPT Corporation simultaneously signed strategic cooperation agreements with leading domestic and international corporations in the semiconductor and electronics sectors. These partnerships aim to strengthen FPT’s strategic direction of mastering core technologies and completing a closed-loop semiconductor value chain. This initiative represents a proactive step in implementing national directives under Resolution 57-NQ/TW, Decision No. 1131/QĐ-TTg, and Decision No. 1018/QĐ-TTg, contributing to Vietnam’s deeper integration into the global supply chain.

FPT and Viettel Collaborate to Build Semiconductor Self-Reliance

Specifically, FPT has entered into a comprehensive partnership with Viettel Group to develop self-reliant capabilities in semiconductor technology. The collaboration spans the entire semiconductor value chain, including training, design, fabrication, testing, packaging, and commercialization. A key focus is the joint development of AI-on-Edge SoC chips on 28–32nm process nodes for camera ecosystems, drones, unmanned aerial vehicles (UAVs), and smart devices.

This strategic alliance between two of Vietnam’s leading corporations aims to complete a closed semiconductor ecosystem. Following Viettel’s groundbreaking of Vietnam’s first semiconductor fabrication plant on January 16, and FPT’s announcement of its advanced testing and packaging facility, these developments underscore a strong national commitment to mastering key stages of the semiconductor value chain.

FPT and Restar Advance Semiconductor Packaging and Testing Technologies

FPT and Restar Corporation—a leading Japanese technology and electronics distribution group—will accelerate R&D in semiconductor packaging and testing technologies and commercialize FPT-packaged and tested chip products.

In addition, FPT has signed a cooperation agreement with Restar Corporation, a leading technology and electronics distribution group from Japan—one of the world’s semiconductor powerhouses. The partnership focuses on advancing research and development in semiconductor packaging and testing technologies, as well as commercializing chip products packaged and tested by FPT in global markets.

Previously, the two parties exchanged a memorandum of understanding on semiconductor cooperation in 2025, witnessed by the Prime Ministers of Vietnam and Japan. The collaboration aims to combine FPT’s strengths in chip design with Restar’s extensive market network and distribution channels in Japan and across the Asia-Pacific region.

By the end of December 2025, FPT delivered its first commercial batch of power management chips to a leading Japanese electronics company through Restar’s distribution network. This marks the first time a Vietnamese enterprise has exported commercial semiconductor chips to the Japanese market—known for its stringent standards.

FPT and Winpac Promote Semiconductor Packaging and Testing Cooperation

FPT and Winpac Inc., a leading South Korean OSAT company, will promote commercial cooperation in semiconductor packaging and testing.

In South Korea—another global semiconductor powerhouse—FPT has signed a cooperation agreement with Winpac Inc., a leading OSAT (Outsourced Semiconductor Assembly and Test) company specializing in semiconductor packaging and testing solutions with an extensive network of clients and partners. The two sides will focus on promoting commercial cooperation in semiconductor packaging and testing, including exploring joint investment opportunities in building FPT’s testing and packaging factory in Vietnam.

In 2025, FPT significantly expanded its presence in the South Korean market, enabling its chip products to penetrate deeper into the country’s semiconductor ecosystem.

FPT and VSAP LAB Strengthen Domestic Semiconductor Ecosystem

FPT and VSAP LAB collaborate comprehensively from research to mass production to optimize advanced packaging and testing capabilities.

To further strengthen Vietnam’s domestic semiconductor ecosystem, FPT has partnered with VSAP LAB, based in Đà Nẵng. VSAP LAB is the developer of Vietnam’s first lab-fab project for advanced semiconductor packaging, with a total investment of USD 72 million (approximately VND 1.8 trillion).

The two parties have established a comprehensive partnership spanning from research to mass production to optimize advanced packaging and testing capabilities, while also developing a highly skilled workforce for the semiconductor industry. They will focus on three key areas: value chain collaboration from R&D to high-volume manufacturing (HVM) in advanced packaging; joint business development for advanced packaging and testing services (including reliability testing and failure analysis); and specialized workforce training in advanced packaging (AP).

With a team of Vietnamese experts possessing extensive international experience and modern semiconductor-standard production lines, VSAP LAB is a strategic partner for FPT to expand its R&D capabilities and contribute to building a “Make in Vietnam” semiconductor enterprise network.

At the event, FPT also announced plans to research and develop AI-on-Edge SoC chips, aiming to fully master the smart device ecosystem, including cameras, drones, and UAVs.

FPT has over a decade of experience in the semiconductor industry, gradually building capabilities across chip design, test software development, workforce training, and commercial chip exports. The Group has established a comprehensive semiconductor ecosystem covering design, packaging, testing, and talent development, with the goal of positioning Vietnam as a key semiconductor hub in the region. FPT is focusing on developing core chip lines such as Power ICs and Power Management ICs (PMICs), while advancing research into AI-on-Edge SoCs.

In parallel, FPT is accelerating the development of high-quality semiconductor talent, targeting the training of 10,000 semiconductor engineers by 2030 through a multi-tiered education system and international partnerships. A notable initiative is the “2+2” program, where students study for two years at FPT University and two years in Taiwan or South Korea, followed by internships at leading companies.

In 2025, FPT inaugurated a High-Tech and Semiconductor Center in Đà Nẵng and the Vietnam Semiconductor Innovation Center (V.S.I.C) in Hà Nội. The Group has also strengthened partnerships with domestic and international organizations such as ABOV Semiconductor, Asia University, and Gachon University to advance semiconductor training and development.

The establishment of FPT’s Advanced Semiconductor Testing and Packaging Factory demonstrates the Group’s commitment to implementing Resolution 57-NQ/TW, Decision No. 1131/QĐ-TTg on strategic technologies, and Decision No. 1018/QĐ-TTg on the national semiconductor industry development strategy. These policies set targets for Vietnam to have 10 advanced testing and packaging plants by 2030 and to develop a semiconductor workforce of 50,000 people, including at least 35,000 personnel in manufacturing, packaging, testing, and related stages.

The FPT Advanced Semiconductor Testing and Packaging Factory will be equipped with full functional testing lines (ATE testers and handlers) and specialized reliability and durability testing systems, compliant with international quality management standards. Upon completion of its two phases, the facility is expected to reach an annual capacity of billions of units. In parallel, FPT will enhance its testing capabilities for advanced chips serving IoT, automotive applications, and AI-on-Edge SoCs, further completing the semiconductor value chain.